Job Description
About QpiAI
At QpiAI, we are leading efforts in discovering the most optimal AI and Quantum systems in Life sciences, Healthcare, Transportation, Finance, Industrial, Space technologies. QpiAI is building a full-stack Enterprise Quantum Computers.
QpiAI Quantum hardware team is responsible for designing and charaterisation of Quantum Processor, Cryogenic Quantum Control Circuits, RF Control Hardware and QpiAI ASGP.
Job Description
As a Deposition Equipment Engineer at QpiAI, you will be responsible for operating, maintaining, and optimizing our thin-film deposition tools used in superconducting quantum processor fabrication. You will work closely with process engineers and device designers to ensure uniform, high-quality thin films across multi-layer metal stacks. The role involves preventive maintenance, vacuum system management, contamination control, and troubleshooting to maintain high tool uptime. You will also collaborate on process improvements and support metrology for film characterization to achieve reproducible, high-yield quantum devices.
Requirements
• MSc/M.Tech/PhD Degree in Physics, Electrical Engineering, Materials Science, or a related field with a focus on quantum mechanics or quantum technology.
• Hands-on experience operating and maintaining UHV sputtering systems (DC/RF), including chamber conditioning, target handling, and deposition stability.
• Strong knowledge of thin-film processes for superconducting materials such as Nb, Al, TiN, multilayer metal stacks, and adhesion/barrier layers.
• Expertise in vacuum systems, including turbomolecular pumps, cryo pumps, gauges, leak detection, and vacuum troubleshooting.
• Familiarity with thermal and e-beam evaporation systems and/or ALD tools, with ability to maintain uniformity and repeatability.
• Experience monitoring film quality via XRD, ellipsometry, AFM, SEM, and stress measurement tools.
• Ability to execute and optimize preventive maintenance schedules, chamber cleans, and equipment calibration.
• Knowledge of contamination control, target poisoning, film purity, and chamber material interactions.
• Strong documentation, SPC/FDC data interpretation, and equipment-level root-cause troubleshooting skills.
